Silicon wafer

SHIJIA’s optical splitter wafer is developed by using planar light wave circuit technology. Its different channel is fabricated on the quartz through growing, lithography, etches and other
process. The high reliable optical splitter chips can be obtained through lid glass bonding, cutting, grinding, and polishing process.

Features:
6 inch size
Low insertion loss and PDL
Good uniformity
Wide range operating wavelength

Applications:
FTTH/FTTB/FTTC/CATV Network system
PON (Passive Optical Network)
Optical fiber equipment & system

Wafer Specifications:
PARAMETER :SPECIFICATION
Diameter : 6 inch (150±0.5mm)
Orientation : Flat 47.5±5mm
Thickness : 1050±100m
Thermal Property : <150
Material : Quartz